Apple has signed a multi-year, multi-billion dollar deal with Broadcom, a US-based chip maker. the company announced the news Tuesdaysaying it will continue to work with the chipmaker to develop 5G components and other wireless connectivity parts.
Through this collaboration, Broadcom will develop 5G RF components, including FBAR filters, and cutting-edge wireless connectivity components. The FBAR filters will be designed and built at several key US manufacturing and technology centers, including Fort Collins, Colorado, where Broadcom has a major facility.
Apple has already partnered with Broadcom to make Wi-Fi and Bluetooth technology for its iPhones. However, rumors earlier this year indicated that Apple had been working on its own in-house chip to replace Broadcom’s. At the time, a report of Bloomberg suggested it planned to use the new chip in 2025, but it’s unclear how this deal might tie in with those plans.
Apple says its multi-year partnership with the company “will allow Broadcom to continue to invest in critical automation projects and improve the skills of technicians and engineers” and is part of Apple’s efforts to invest $430 billion in the US. over the course of five years. Under the CHIPS and Science Act, the US will provide $52 billion in subsidies for companies to build chips in the US Apple will start using some of the chips made at TSMC’s Arizona factory once it opens.
“We are delighted to make commitments that harness the ingenuity, creativity and innovative spirit of American manufacturing,” Apple CEO Tim Cook said in a statement. “All Apple products depend on technology designed and built right here in the United States, and we will continue to deepen our investments in the US economy because we have unwavering faith in America’s future.”
